Sr. Packaging Engineer (Semiconductor)

Semtech · Hyderabad, IN

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Responsibilities: · Lead Advanced Package Development: Define, develop, and qualify advanced package architectures (WLCSP, DFN, QFN, flip-chip, multi-die) for TVS, TDS, and Hot Switch protection products, ensuring electrical, thermal, and mechanical performance requirements are met across the full product portfolio. (25%) · OSAT Partner Management: Serve as a technical interface with external assembly and test (OSAT) partners, supporting process capability improvements,...